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• Micro-area High-Sensitivity X-ray Fluorescence Spectrometer (HS XRF®)
• Core Technologies
Hardware: Monochromatic Focusing Technology HS XRF®
Software: Holospec FP®
1) Hardware Core Technology: Monochromatic Focusing Excitation Technology
Monochromatic Focusing Excitation Technology
A fully focusing hyperbolic curved crystal diffracts only the high-intensity characteristic X-rays from the X-ray tube emission spectrum, monochromating the X-rays incident on the sample and focusing them onto a single point. Therefore, the X-rays emitted from the sample consist only of the fluorescent X-rays generated by exciting the elements in the sample and the scattered rays of the monochromated incident spectrum line, with no continuous scattering background present. This ensures extremely low background interference for the characteristic lines of the elements to be measured.
2) Software Core Technology: Holospec FP
The challenges faced by XRF methods are matrix effects, inter-element absorption-enhancement effects, and the lack of standard samples, posing difficulties for quantitative analysis of different types of samples.
Holospec FP (Holospec FP 2.0®) calculates every stage of X-ray fluorescence spectroscopy from generation to detection, establishing corresponding mathematical models for well-defined physical phenomena in physics. Holospec FP eliminates background differences caused by matrix variations in different sample types, reduces analytical errors, and enables precise quantitative elemental analysis results through calibration with a few standard samples.
- • Micro-area
PHECDA-FVS focuses the minimum spot size to φ200μm on the sample point, equipped with four different focusing aperture spots, switchable via software control, meeting micro-area imaging analysis and major/minor element composition analysis. Customization from φ200μm to φ5000μm is supported, and rectangular parallel beam incidence on the sample can be configured.
• X-Y Stage
Software-controlled precision movement of the X-Y Stage, with a movement range of ±10mm and a step size of 10μm/step.
• Imaging
Miniature high-definition camera, with an optical path perpendicular to the sample plane, providing 10~100x magnification. Software tunes the X-ray spot position to coincide with the focused imaging position.
• Large Sample Chamber
Larger-sized or irregularly shaped samples can be directly placed into the sample chamber and positioned via the camera. The sample chamber dimensions are 280mm (L) × 230mm (W) × 70mm (H).
• Holospec FP
Seamless integration of PHECDA-FVS with Holospec FP enables coating, layer, and stack thickness and composition analysis, and standardless elemental quantification.
Specifications Parameters Principle Monochromatic Excitation - Energy Dispersive X-ray Fluorescence Spectrometry Algorithm Holospec FP Elemental Range Mg - U Detection Limit (LOD) S:10mg/kg, Fe:2mg/kg, Pb:1.0mg/kg, Cd:0.3mg/kg (Large spot mode, light matrix sample) Thickness Measurement Range 1nm – 50μm (Plating samples, depends on metal type); 0.1μm - 1000μm (Coating samples) Sample Types Plated samples, Coated samples Software Holospec FP software system, supporting various sample application development, spectrum display and comparison, standardless quantification, standard sample calibration, elemental quantitative analysis, data storage, network transmission Hardware Configuration Micro-area analysis, High-definition imaging, Large sample chamber, High-precision X-Y stage
For detailed technical parameters and application solutions, please consult Ancoren staff.
Industry Application Problem Solved Application Features NdFeB Permanent Magnet (Dy, Tb) Permeation Layer Thickness Analysis Can test the coating thickness of elements such as Terbium (Tb) and Dysprosium (Dy) on the surface of NdFeB materials, the thickness of the permeation layer formed under different process conditions, permeation layer saturation thickness analysis, etc. · Micro-area and high-precision imaging, position visible and controllable;
· High-precision X-Y Stage movement, clearly characterizing permeation layer thickness information.Surface Plating Testing Solution for Parts · Tests the thickness and uniformity of metal plating on part surfaces, providing reference data for properties like wear resistance and oxidation resistance;
· Capable of analyzing multi-layer plating samples.· Utilizes micro-area imaging to test surface plating precisely at specific points;
· Can directly determine elemental content in liquid samples.Perovskite Thin Film Solar Cell Stack Analysis Analysis of the stack thickness and elemental content from the bottom electrode, electron transport layer, perovskite layer, to the top electrode in perovskite solar cells, providing solutions for industrial uniformity indicators and stability of perovskite batteries. · Holospec FP achieves high-precision resolution of thickness and composition information for complex stacks through full-spectrum fitting;
· Compared to conventional methods, offers deeper X-ray penetration thickness.Silicon Wafer Plating Testing Solution Tests the metal plating on the surface of silicon wafers · Short testing time, accurate results, high repeatability precision;
· Non-destructive testing, does not damage the sample.Surface Organic Coating Thickness Testing (e.g., Dacromet coating, etc.) Determination of the thickness of organic coatings on metal surfaces · Direct determination of organic coating area density;
· Extremely high repeatability precision for coatings in the μm thickness range.
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